![]() |
Technology
1. Die-cutting process
2. Etching process
above 0.15mm thickness can be used to half etching
etching SUS with adhesive, tape appearance unilateral need reduce 0.15mm, inner bore unilateral need increase 0.15mm is relative to SUS appearance.
3. Punching process
|
![]() Copyright owners: Shenzhen TengXin Precision Adhesive Products CO., LTD E-mail:metaldome@vip.163.com sztengxin2008@163.com
Address: Building D, Ganglian gebu second Industrial Zone, Hongxing village, SongGang Town, Bao An District, Shen Zhen City, Guang Dong ,China |
![]() |